EE143, Fall 2016
Microfabrication Technologies |
- Lecture Schedule
- Introduction to Materials and Processing (1-2 weeks)
- Photolithography (2 weeks)
- Etching (1 week)
- Oxidation (1 week)
- Deposition (1 week)
- Diffusion (1 week)
- Ion Implantation (1 week)
- Metallization/CMP (1 week)
- Simulation/Layout Process Integration (throughout)
- Introduction to Devices (2 weeks)
- Lab Schedule
- Week 1: Aug. 29- Sept. 2 —— safety (GSI does field oxidation in nanolab)
- Week 2: Sept. 5-Sept. 9 —— active area lithography and etching
(Monday is a holiday this week. Cycle changes from Wed. to next Mon.)
- Week 3: Sept. 12-Sept. 16 —— gate oxidation
(Mon or Tue: GSI does poly-silicon deposition in nanolab)
- Week 4: Sept. 19-Sept. 23 —— gate lithography and poly & oxide etching
- Week 5: Sept. 26-Sept. 30 —— source-drain deposition & drive-in and intermediate oxidation
- Week 6: Oct. 3-Oct. 7 —— contact hole lithography and etching
- Week 7: Oct. 10- Oct. 14 —— metallization
- Week 8 Oct. 17-Oct. 21 —— Metal defining lithography and etching & sintering
- Week 9-14 Oct. 24- Dec. 2 (five weeks) —— Testing
(Fri. Nov. 11, Wed. Nov. 23, Th. Nov. 24, Fri. Nov. 25 are holidays or non-instructional day.)
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Last updated
August 25, 2016
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