Fall 2011 Lecture Notes:
| No.
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Date
|
Lecture
|
Module
|
PDF
(marked)
|
Reading
|
| 1
|
Aug. 25
|
Administrative Information, MEMS Roadmaps, Benefits of Miniaturization
|
[PDF]
|
[PDF]
[PDF]
|
S: §1.1-1.4
|
| 2
|
Aug. 30
|
Benefits of Scaling I: faster speed (transistors, micromechanical resonators)
|
[PDF]
|
[PDF]
[PDF]
|
none
|
| 3
|
Sept. 1
|
Benefits of Scaling II: lower power consumption (micro-ovens)
|
|
[PDF]
[PDF]
|
none
|
| 4
|
Sept. 6
|
Benefits of Scaling III: higher sensitivity (gas sensors)
|
|
[PDF]
[PDF]
|
none
|
| 5
|
Sept. 8
|
Fabrication Process Modules I: oxidation, film deposition, lithography
|
[PDF]
|
[PDF]
[PDF]
[PDF]
|
S: §3.1-3.2.3, §3.2.6, §3.3.1
J: §2.1, §2.3-2.5, §3.1-3.3, §3.6, §6.1-6.3
|
| 6
|
Sept. 13
|
Fabrication Process Modules II: etching, ion implantation, diffusion
|
[PDF]
|
[PDF]
[PDF]
[PDF]
|
S: §3.2.5, §3.3.4.1, §3.3.5-3.3.6
J: §2.2, §4.1-4.5, §5.1-5.5
|
| 7
|
Sept. 15
|
Surface Micromachining I: basic polysilicon process flow, release, sacrificial & structural material choices
|
|
[PDF]
[PDF]
|
S: §4.1-4.4
J: §11.4.1-11.4.2
|
| 8
|
Sept. 20
|
Surface Micromachining II: 2nd order issues, stiction, residual stress, electroplating, 3D out-of-plane MEMS
|
[PDF]
|
[PDF]
[PDF]
[PDF]
[PDF]
[PDF]
|
S: §8.3, §13.2.3
J: §11.4.3-11.4.4
|
| 9
|
Sept. 22
|
Surface Micromachining III: MUMPS, design rules, Summit
|
|
[PDF]
[PDF]
|
Handout
|
| 10
|
Sept. 27
|
Bulk Micromachining: wet etch-based, dissolved wafer process, SOI MEMS, Scream, Hexsil MEMS, sealed cavity deep RIE
|
|
[PDF]
[PDF]
|
S: §3.3.4.2-3.3.4.3
J: §11.2-11.3, §11.6
|
| 11
|
Sept. 30
|
Mechanics of Materials for MEMS I: stress, strain, material properties, measurement & characterization of mechanical parameters.
|
[PDF]
|
[PDF]
[PDF]
[PDF]
|
S: §8.1-8.2, §8.4
|
| 12
|
Oct. 3
|
Mechanics of Materials for MEMS II: quality factor, beam bending
|
[PDF]
|
[PDF]
[PDF]
[PDF]
|
S: §7.2.2, §9.1-9.3
|
| 13
|
Oct. 6
|
Machanics of Materials for MEMS III: practical stress, beam combos, stressed folded flexures
|
|
[PDF]
[PDF]
|
|
| 14
|
Oct. 11
|
Energy Methods I: virtual work, energy formulations, tapered beam example
|
[PDF]
|
[PDF]
[PDF]
|
S: §10.1-10.3
|
| 15
|
Oct. 13
|
Energy Methods II: clampled-clamped beam example, large deflection analysis, estimating resonance frequency
|
[PDF]
|
[PDF]
|
S: §10.5
|
| 16
|
Oct. 18
|
Equivalent Circuits I: dynamic mass, stiffness, and damping, example: free-free beam, lumped mass-spring-damper circuit
|
|
[PDF]
[PDF]
|
S: §10.5.2, Handout
|
| 17
|
Oct. 20*
|
Equivalent Circuits II: electromechanical analogies, lossless transducers
|
|
[PDF]
[PDF]
[PDF]
|
S: §5.1-5.6, Handout
|
| 18
|
Oct. 25
|
Lossless Transducers I: capacitive transducers, charge control, voltage control, spring suspended C, parallel-plate capacitive transducer, pull-in, linearization
|
|
[PDF]
[PDF]
[PDF]
|
S: §6.1-6.4
|
|
|
Oct. 27
|
MIDTERM EXAM
|
|
|
|
| 19
|
Nov. 1
|
Lossless Transducers II: electrical stiffness, comb drive, levitation |
[PDF]
[PDF]
|
[PDF]
|
Handouts |
| 20
|
Nov. 3
|
Equivalent Circuits III: input modeling, force-to-velocity relationship & circuit, intro. to gyroscopes
|
[PDF]
|
[PDF]
[PDF]
[PDF]
|
S: §6.6, §19.1-19.2, §21.1-21.2
|
| 21
|
Nov. 8
|
Equivqalent Circuits IV: output modeling, input-to-output transconductance, complete equivalent circuit
|
|
[PDF]
[PDF]
|
Handout
|
| 22
|
Nov. 10
|
Sensing Circuits I: ideal op amps, velocity sensing, position sensing
|
|
[PDF]
[PDF]
|
S: §14.9, §14.11.2,
|
| 23
|
Nov. 15
|
Sensing Circuits II: differential position sensing, MEMS/transistor integration
|
[PDF]
|
[PDF]
[PDF]
|
S: §19.1-19.4,
J: §7.7, §9.3, §11.7
|
| 24
|
Nov. 17
|
Sensing Circuits III: non-ideal op amps, begin noise
|
|
[PDF]
[PDF]
|
S: §14.10-14.11, S: Chpt 15
|
| 25
|
Nov. 22
|
Sensor Resolution I: noise sources, noise calculation, min. detectable signal
|
[PDF]
[PDF]
|
[PDF]
[PDF]
|
S: §16.1, §16.3-16.6
|
|
|
Nov. 24
|
THANKSGIVING - HOLIDAY
|
|
|
|
| 26
|
Nov. 29
|
Sensor Resolution II: noise calculation examples, gyro example
|
|
[PDF]
[PDF]
|
Handouts
|
| 27
|
Dec. 1
|
MEMS-Transistor Integration: mixed, MEMS-first, MEMS-last
|
|
[PDF]
[PDF]
|
Handouts
|
|
|
Dec. 6
|
Reading/Recitation/Review Day - No Lecture
|
|
|
|
|
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Dec. 8
|
Reading/Recitation/Review Day - No Lecture
|
|
|
|
|
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Dec. 13
|
FINAL EXAM: Tuesday, Dec. 13, 8-11 a.m.
|
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|
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NOTE: * The asterisks indicate days that I ll not be in town. On these dates, I will make appropriate arrangements for the lecture, which will probably entail doing and recording
(for website posting) a make-up lecture at a specified time and location.
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