No.
|
Date
|
Lecture
|
Module
|
PDF
|
Reading
|
1
|
Aug. 23
|
Administrative Information, Overview and Introduction to MEMS
|
1
[PDF]
|
[PDF]
[PDF]
|
S: §1.1-1.4
|
2
|
Aug. 28
|
Benefits of Scaling I: faster speed (transistors, micromechanical resonators)
|
2
[PDF]
|
[PDF]
[PDF]
|
none
|
|
*Aug. 30, this lecture was absorbed into longer lectures on the following days.
|
|
|
| none
|
3
|
Sept. 4
|
Benefits of Scaling II: lower power consumption (micro-ovens)
|
|
[PDF]
[PDF]
| none
|
4
|
Sept. 6
|
Benefits of Scaling III: higher sensitivity (gas sensors)
|
|
[PDF]
|
none
|
5
|
Sept. 11
|
Fabrication Process Modules I: oxidation, film deposition, lithography
|
3 [PDF]
|
[PDF]
[PDF]
[PDF]
|
S: §3.1-3.2.3, §3.2.6, §3.3.1
J: §2.1, §2.3-2.5, §3.1-3.3, §3.6, §6.1-6.3
|
6
|
Sept. 13
|
Fabrication Process Modules II: etching, ion implantation, diffusion
|
4 [PDF]
|
[PDF]
[PDF]
[PDF]
|
S: §3.2.5, §3.3.4.1, §3.3.5-3.3.6
J: §2.2, §4.1-4.5, §5.1-5.5
|
7-8
|
Sept. 18
|
Fabrication Process Modules III: Etching: wet etching, dry etching; Semiconductor doping: ion implantation; diffusion
|
|
[PDF]
[PDF]
|
S: Chapter 3
J: Chapters 2, 4, 5
|
9
|
Sept. 20
|
Surface Micromachining I: Polysilicon surface micromachining
|
5 [PDF]
|
[PDF]
[PDF]
|
S: Chapter 3
J: Chapter 11
|
10
|
Sept. 25
|
Surface Micromachining II: Stiction
|
|
[PDF]
[PDF]
|
Surface Micromachining for Microelectrical Systems
Etch Rates for Micromachining Processing
Etch Rates for Micromachining Processing - Part II
|
11
|
Sept. 27
|
Surface Micromachining II (cont.): Residual stress, topography issues, nickel metal surface micromachining, 3D "pop-up" MEMS, Foundry MEMS: the "MUMPS" process, the Sandia SUMMIT process
Bulk Micromachining: Anisotropic Etching of Silicon
|
6 [PDF]
|
[PDF]
[PDF]
[PDF]
|
S: §3.3.4.2-3.3.4.3
J: §11.2-11.3, §11.6
|
12
|
Oct. 2
|
Bulk Micromachining (cont.): Boron-doped etch stop, electrochemical etch stop, isotropic etching of silicon, Deep Reactive Ion Etching (DRIE), Wafer bonding
Mechanics of Materials for MEMS I: stress, strain, etc., for isotropic materials
|
7 [PDF]
|
[PDF]
[PDF]
[PDF]
|
S: §8.1-8.2, §8.4
|
13
|
Oct. 4
|
Mechanics of Materials for MEMS II: Thin films: thermal stress, residual stress, and stress gradients; internal dissipation, MEMS material properties and performance metrics
|
8 [PDF]
|
[PDF]
[PDF]
|
S: Chapter 8
|
14
|
Oct. 9
|
Beam bending I
|
|
[PDF]
[PDF]
|
S: Chapter 9
|
15
|
Oct. 11
|
Stress Gradients
|
9 [PDF]
|
[PDF]
[PDF]
|
S: Chapter 9
|
16
|
Oct. 16
|
Beam Combos I
|
|
[PDF]
[PDF]
|
S: Chapter 9
|
17
|
Oct. 18
|
Beam Combos II
|
|
[PDF]
[PDF]
|
S: Chapter 9
|
18
|
Oct. 23
|
Energy Methods
Resonance Frequency
|
10 [PDF]
|
[PDF]
[PDF]
[PDF]
|
S: Chapter 10
|
|
Oct. 25
|
MIDTERM EXAM
|
|
|
|
19
|
Oct. 30
|
Resonance Frequency
|
|
[PDF]
|
S: §10.5; Chapter 19
|
20
|
Nov. 1
|
Resonance Frequency
Equivalent Circuits I
|
11 [PDF]
12
[PDF]
|
[PDF]
[PDF]
[PDF]
|
S: Chapters 5 and 6
|
21
|
Nov. 6
|
Capacitive Transducers
|
|
[PDF]
|
S: Chapters 5 and 6
|
22
|
Nov. 8
|
Electrical Stiffness
|
|
[PDF]
[PDF]
|
S: Chapters 5 and 6
|
|
Nov. 13: This lecture was absorbed into longer lectures on following days
|
|
|
|
|
23-24
|
Nov. 15
|
Comb Drive
Equivalent Circuits II
|
13
[PDF]
|
[PDF]
[PDF]
[PDF]
|
S: Chapters 5, 6 and 14
|
25
|
Nov. 20
|
Sensing Circuits I
Gyros, Noise and MDS
|
14
[PDF]
15
[PDF]
|
[PDF]
[PDF]
[PDF]
|
S: Chapters 14, 16 and 21
|
|
Nov. 22
|
THANKSGIVING - HOLIDAY
|
|
|
|
26
|
Nov. 27
|
Gyroscopes and Sensing Circuits
|
|
[PDF]
[PDF]
|
S: Chapters 14, 16 and 21
|
27
|
Nov. 29
|
Sensing Circuits II
|
|
[PDF]
[PDF]
|
S: Chapter 14
|
|
Dec. 4
|
Reading/Recitation/Review Day - No Lecture
|
|
|
|
|
Dec. 6
|
Reading/Recitation/Review Day - No Lecture
|
|
|
|
|
Dec. 14
|
FINAL EXAM: Friday, Dec. 14, 7-10 p.m.
|
|
|
|