EE290G Intro to MEMS
Homework 4
Due 2/20/97

1. Repeat HW2, question 1, for the following journals.

Journal of Intelligent Materials and Systems
Ferroelectrics
IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control

2. How small is small? There are many manufacturing processes other than silicon micromachining for making small parts. Do some research to find specifications for the manufacturing proceses listed below. Search the web, call companies, use the yellow pages, use a Thomas's register, ask a machinist, ask your instructor, etc. We're looking for the lower limits on traditional machining or tools that might be currently commercially available at a local job shop, say, or a tool distributor. The objective is to get a feel for the boundary between MEMS and traditional machining. Turn the answers in electronically (in both English and metric units) by email to ee290g@po.eecs. Give a reference for each answer such as company name, address, phone and fax numbers, email and URL addresses, and we'll make a database on the class web page for all to share for future reference. Feel free to work in groups and split up the search.

Lathe: smallest collet for holding stock, smallest hole you can drill, smallest repeatable and non-repeatable runout
Milling machine: diameter of the smallest end mills and drill bits available, resolution of the X-Y stage
Disco saw in the Microlab: kerf - smallest cut which can be made
Stamping: smallest line-width and thicknesses that can be stamped
Punching: smallest punch diameter available
Chemically etched parts: smallest line widths and spaces
Waterjet cutting: smallest hole and smallest kerf (width of a cut)
Ink jet printing: smallest dot size
Ultrasonic milling: smallest hole and smallest kerf
Diamond turning: same as for lathe
EDM: smallest holes and slots
Laser machining: smallest hole and smallest kerf
Printed circuit boards: minimum line widths and spaces
Offset printing: minimum line widths and spaces
Chemo-mechanical polishing: minimum removable thickness, maximum achievable flatness
Electroplating: minimum RMS roughness
Injection molding: best tolerance for different materials
Silk screening: minimum line widths and spaces, film thickness
Sterolithography: smallest solid that can be made, smallest line widths and spacings

Smallest watch gear: diameter, thickness
Smallest screw: diameter
Smallest DC motor: diameter and length, stall torque and no-load speed for rated voltage
Best resolution on a pair of calipers
Best resolution with a micrometer

3. Read the articles handed out in class, "Ferroelectric Devices" and "Ferroelectric Sensors and Actuators: Smart Ceramics". Write a one paragraph summary of each.

4. Show the equivalence of the four forms of the piezoelectric constitutive relations by solving for the materials constants' relationships.

5. Compare the materials constants of 3D, plane stress, and plane strain for PZT-4 and PZT-5H.