| No.
|
Date
|
Lecture
|
Module
|
PDF
(marked)
|
Reading
|
Video
|
| 1
|
Jan. 27
|
Administrative Information, MEMS Roadmaps, Benefits of Miniaturization
|
Module1
|
Lecture1
|
|
|
| 2
|
Jan. 29
|
Benefits of Scaling I: faster speed (transistors, micromechanical resonators)
|
Module2
|
Lecture2m
Lecture2w
|
|
|
| 3
|
Feb. 3
|
Benefits of Scaling II: lower power consumption (micro-ovens)
|
Module3
|
Lecture3m
Lecture3w
|
|
|
| 4
|
Feb. 5
|
Benefits of Scaling III: higher sensitivity (gas sensors)
|
Module4
|
Lecture4
|
|
|
| 5
|
Feb. 10
|
Fabrication Process Modules I: oxidation, film deposition, lithography
|
Module5
|
Lecture5m
Lecture5w
|
|
|
| 6
|
Feb. 12
|
Fabrication Process Modules II: etching, ion implantation, diffusion
|
|
Lecture6m1
Lecture6m2
Lecture6w
|
Reading6a
Reading6b
|
|
| 7
|
Feb. 17
|
Surface Micromachining I: basic polysilicon process flow, release, sacrificial & structural material choices
|
|
Lecutre7m
Lecture7w
|
|
|
| 8
|
Feb. 19
|
Surface Micromachining II: 2nd order issues, stiction, residual stress, electroplating, 3D out-of-plane MEMS
|
Module6
|
Lecture8m1
Lecture8m2
Lecture8w
|
|
|
| 9
|
Feb. 24
|
Surface Micromachining III: MUMPS, design rules, Summit
|
Module7
|
Lecture9m1
Lecture9m2
Lecture9w
|
|
|
| 10
|
Feb. 26
|
Bulk Micromachining: wet etch-based, dissolved wafer process, SOI MEMS, Scream, Hexsil MEMS, sealed cavity deep RIE
|
Module8
|
Lecture10m
Lecture10w
|
|
|
| 11
|
Mar. 3
|
Mechanics of Materials for MEMS I: stress, strain, material properties, measurement & characterization of mechanical parameters.
|
|
Lecture11m
Lecture11w
|
|
|
| 12
|
Mar. 5
|
Mechanics of Materials for MEMS II: quality factor, beam bending
|
|
Lecture12m
Lecture12w
|
|
|
| 13
|
Mar. 10
|
Machanics of Materials for MEMS III: practical stress, beam combos, stressed folded flexures
|
Module9
|
Lecture13m
Lecture13w
|
|
|
| 14
|
Mar. 12
|
Energy Methods I: virtual work, energy formulations, tapered beam example
|
Module10
|
Lecture14m
Lecture14w
|
|
|
| 15
|
Mar. 17
|
Energy Methods II: clampled-clamped beam example, large deflection analysis, estimating resonance frequency
|
Module11
|
Lecture15m
Lecture15w
|
|
|
|
|
Mar. 19
|
Midterm Exam
|
|
|
|
|
|
|
Mar. 24
|
Spring Break
|
|
|
|
|
|
|
Mar. 26
|
Spring Break
|
|
|
|
|
| 16
|
Mar. 31
|
Equivalent Circuits I: dynamic mass, stiffness, and damping, example: free-free beam, lumped mass-spring-damper circuit
|
Module12
|
Lecture16m
Lecture16w
|
|
|
| 17
|
Apr. 2
|
Equivalent Circuits II: electromechanical analogies, lossless transducers
|
|
Lecture17m
Lecture17w
|
|
|
| 18
|
Apr. 7
|
Lossless Transducers I: capacitive transducers, charge control, voltage control, spring suspended C, parallel-plate capacitive transducer, pull-in, linearization
|
|
Lecture18m
Lecture18w
|
|
|
| 19
|
Apr. 9
|
Lossless Transducers II: electrical stiffness, comb drive, levitation
|
Module13
|
Lecture19m
Lecture19w
|
|
|
| 20
|
Apr. 14
|
Equivalent Circuits III: input modeling, force-to-velocity relationship & circuit, intro. to gyroscopes
|
Module14
Module15
|
Lecture20m1
Lecture20m2
Lecture20w
|
|
Video Lecture20
|
| 21
|
Apr. 16
|
Equivalent Circuits IV: output modeling, input-to-output transconductance, complete equivalent circuit
|
|
|
|
Video Lecture21
|
| 22
|
Apr. 21
|
Sensing Circuits I: ideal op amps, velocity sensing, position sensing
|
Module16 |
Lecture22m1
Lecture22w
|
|
|
| 23
|
Apr. 23
|
Sensing Circuits II: differential position sensing, MEMS/transistor integration
|
Module17
|
Lecture23m1
Lecture23m2
Lecture23w
|
|
Video Lecture23
|
| 24
|
Apr. 28
|
Sensing Circuits III: non-ideal op amps, begin noise
|
|
Lecture24m
Lecture24w |
|
|
| 25
|
Apr. 30
|
Sensor Resolution I: noise sources, noise calculation, min. detectable signal
|
|
Lecture25m
Lecture25w
|
|
|
| 26
|
|
Sensor Resolution II: noise calculation examples, gyro example
|
|
|
|
|
| 27
|
|
Sensor Sustaining Oscillator Circuits
|
|
|
|
|
|
|
May 5
|
Reading/Recitation/Review Day - No Lecture
|
|
|
|
|
|
|
May 7
|
Reading/Recitation/Review Day - No Lecture
|
|
|
|
|
|
|
May 15
|
Final Exam: Friday, May 15, 7-10 p.m. (Exam Group 20)
|
|
|
|
|