No.
|
Date
|
Lecture
|
Module
|
PDF
(marked)
|
Handout
|
Video
|
1
|
Jan. 16
|
Administrative Information, MEMS Roadmaps, Benefits of Miniaturization
|
:
Module1
|
Lecture1w
Lecture1m
|
|
Video
|
2
|
Jan. 18
|
Benefits of Scaling I: faster speed (transistors, micromechanical resonators)
|
Module2
|
Lecture2m1
Lecture2m2
Lecture2w
|
|
Video
|
3
|
Jan. 23
|
Benefits of Scaling II: lower power consumption (micro-ovens)
|
|
Lecture3-4m
Lecture3-4w
|
|
Video
|
4
|
Jan. 25
|
|
|
Covered in Lecture 3-4
|
|
|
5
|
Jan. 30
|
Benefits of Scaling III: higher sensitivity (gas sensors)
|
|
Lecture5w
Lecture5m1
Lecture5m2
|
|
Video
|
6
|
Feb. 1
|
Fabrication Process Modules I: oxidation, film deposition, lithography, etching
|
|
Lecture6m1
Lecture6m2
Lecture6w
|
|
Video
|
7.x
|
|
Process Module Details Video Lectures
|
Module3
Module4
|
Lectures use Modules 3 & 4
|
|
Video1
Video2
|
7
|
Feb. 6
|
Fabrication Process Modules II: deposition, ion implantation, diffusion
|
|
Lecture7m1
Lecture7w
|
|
Video
|
8
|
Feb. 8
|
Surface Micromachining I: basic polysilicon process flow, release, sacrificial & structural material choices
|
Module5
|
Lecture8m1
Lecture8w
|
Surface Micromachining
Etch Rates
|
Video
|
9
|
Feb. 13
|
Surface Micromachining II: stiction, stress (1st pass), topography, metal MEMS, 3D MEMS, MUMPS
|
|
Lecture9m1
Lecture9w
|
|
Video
|
10
|
Feb. 15
|
Bulk Micromachining: wet etch-based, etch stop methods, dissolved wafer process, SOI MEMS using deep RIE, bonding (fusion, anodic, compression), Hexsil MEMS, SCREAM
|
Module6
|
Lecture10m1
Lecture10m2
Lecture10w
|
|
Video
|
11
|
Feb. 20
|
Mechanics of Materials for MEMS I: stress, strain, material properties
|
Module7
|
Lecture11m1
Lecture11m2
Lecture11w
|
|
Video
|
12
|
Feb. 22
|
Mechanics of Materials for MEMS II: measurement & characterization of mechanical parameters, acoustic velocity, strength, quality factor
|
Module8
|
Lecture12m1
Lecture12m2
Lecture12w
|
|
Video
|
13
|
Feb. 27
|
Beam Bending: internal bending moment, diff. eq. for beam bending, cantilever stiffness, practical stress
|
|
Lecture13w
|
|
Video
|
14
|
Mar. 1
|
Beam Combos I: series & parallel springs, folded flexures, spring circuit analysis
|
|
Lecture14m
Lecture14w
|
|
Video
|
15
|
Mar. 6
|
Beam Combos II: tensioned beam analysis, folded-beam stress
|
|
Lecture15m
Lecture15w
|
|
Video
|
16
|
Mar. 8
|
Energy Methods: virtual work, energy formulations, tapered beam example
|
Module9
|
Lecture16m
Lecture16w
|
|
Video
|
17
|
Mar. 13
|
Resonance Frequency: estimating resonance frequency, lumped mass-spring approximation, distributed mass & stiffness, folded-beam resonator
|
Module10
|
Lecture17m
Lecture17w
|
|
Video
|
18
|
Mar. 15
|
Equivalent Circuits I: dynamic mass, stiffness, and damping, example: free-free beam, lumped mass-spring-damper circuit
|
Module11
|
Lecture18m1
Lecture18w
|
|
Video
|
19
|
Mar. 20
|
Lossless Transducers I: capacitive transducers, charge control, voltage control, spring suspended C, parallel-plate capacitive transducer
|
Module12
|
Lecture19m1
Lecture19w
|
|
Video
|
|
Mar. 22
|
Midterm Exam
|
|
|
|
|
|
Mar. 28
|
Spring Break
|
|
|
|
|
|
Mar. 30
|
Spring Break
|
|
|
|
|
20
|
Apr. 3
|
Lossless Transducers II: pull-in voltage, linearization
|
|
Lecture20m
Lecture20w
|
|
Video
|
21
|
Apr. 5
|
Lossless Transducers III: linearity, electrical stiffness, comb drive
|
|
Lecture21m
Lecture21w
|
|
Video
|
22
|
Apr. 10
|
Equivalent Circuits II: input modeling, force-to-velocity relationship & circuit, output modeling, complete equivalent circuit
|
Module13 |
Lecture22m1
Lecture22m2
Lecture22w
|
|
Video
|
23
|
Apr. 12
|
Mechanical Circuit Analysis & Gyroscopes: impedance, input-to-output transconductance, gyroscopes
|
Module14
Module15
|
Lecture23m1
Lecture23m2
Lecture23w
|
|
Video
|
24
|
Apr. 17
|
Gyros & Sensing Circuits I: gyro limitations, velocity sensing, position sensing, op amp circuits
|
|
Lecture24m
Lecture24w |
|
Video
|
25
|
Apr. 19
|
Sensing Circuits II & Integration: differential position sensing, Integration
|
Module16
Module17
|
Lecture25m1
Lecture25m2
Lecture25w
|
|
Video
|
26
|
Apr. 24
|
Noise: noise sources, noise example, equivalent input noise sources
|
|
Lecture26m
Lecture26w
|
|
Video
|
27
|
Apr. 26
|
Gyro Minimum Detectable Signal (MDS)
|
|
Lecture27m
Lecture27w
|
|
Video
|
|
May 1
|
Reading/Recitation/Review Day - No Lecture
|
|
|
|
|
|
May 3
|
Reading/Recitation/Review Day - No Lecture
|
|
|
|
|
|
May 10
|
Final Exam: Thursday, May 10, 8-11 a.m. (Exam Group 13)
|
|
|
|
|