Week |
Date |
Topic |
Homework |
Solutions/
Grades |
1 |
1/2
1/4 |
Introduction
Materials used in MEMS |
Conf Call |
|
2 |
1/9
1/11 |
Fabrication steps: Deposition, etching and
photolithography. CVD, Oxidation and plasmas
Detailed CVD discussion |
hw1
etchrates |
|
3 |
1/16
1/18 |
Different kinds of etching: Plasma etching, wet,
dry etching, HF etching etc.
Etching: liftoff, surface micromachining, Process examples. |
|
|
4 |
1/23
1/25 |
Start physics of Mems devices. Beam Theory
Beams and electrostatics |
hw2
|
|
5 |
1/30
2/1 |
Flexures / suspensions, electrostatic resonators.
Electrostatic motors. Thermal actuators. |
hw1 due |
|
6 |
2/6
2/8 |
Resonance and analysis of resonance in
electrostatic MEMS resonators.
Linear system analysis. Transfer functions, bode plots, Resonator
electrostatics revisited. |
hw2 due |
|
7 |
2/13
2/15 |
Analysis of thermal actuation. Electrostatic
springs and Pull in.
Pull in (cont’d), Adhesion. |
hw3 |
|
8 |
2/20
2/22 |
Flow in ducts and its implications for dampening
in electrostatic MEMS resonators.
Foundry services and MUMPS |
Conf Call
|
|
9 |
2/27
3/1 |
Foundry services and MUMPS.(cont’d)
CMOS micromachining, actuators, strain gauges, wheatstone bridges |
hw 3 due
|
|
10 |
3/6
3/8 |
Noise in electrical circuits.
Amplifier noise. Noise in cascaded amplifier stages. Capacitive sensing |
hw4
|
|
11 |
3/13
3/15 |
Noise equivalent displacement, accelerometers.
Parasitic capacitances. Test structures.
Connectivity test structures. Residual stress and strain. Assembly and
bonding |
hw4 due
|
|
12 |
3/20
3/22 |
Assembly
Assembly examples and Bonding |
hw5 |
|
13 |
3/27
3/29 |
WORK ON PROJECT
WORK ON PROJECT |
hw5 due |
|
14 |
4/3
4/5 |
WORK ON PROJECT
WORK ON PROJECT |
Conf Call
|
|
15 |
4/10
4/13 |
WORK ON PROJECT
Project Reports Due! Must be postmarked
by 4/13. |
|
|
16 |
4/16-
4/20 |
Final Exam
Must be postmarked by 4/20. |
|
|