EE 245 / NEEM 6441: Introduction to MEMS Design

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Syllabus

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Week Date Topic Homework Solutions/
Grades
1 1/2
1/4
Introduction
Materials used in MEMS
 
Conf Call
 
2 1/9
1/11
Fabrication steps: Deposition, etching and photolithography. CVD, Oxidation and plasmas
Detailed CVD discussion
hw1
etchrates
 
3 1/16
1/18
Different kinds of etching: Plasma etching, wet, dry etching, HF etching etc.
Etching: liftoff, surface micromachining, Process examples.
   
4 1/23
1/25
Start physics of Mems devices. Beam Theory
Beams and electrostatics
 
hw2
 
5 1/30
2/1
Flexures / suspensions, electrostatic resonators.
Electrostatic motors. Thermal actuators.
hw1 due
 
 
6 2/6
2/8
Resonance and analysis of resonance in electrostatic MEMS resonators.
Linear system analysis. Transfer functions, bode plots, Resonator electrostatics revisited. 
 
hw2 due
 
7 2/13
2/15
Analysis of thermal actuation. Electrostatic springs and Pull in.
Pull in (cont’d), Adhesion.
hw3  
8 2/20
2/22
Flow in ducts and its implications for dampening in electrostatic MEMS resonators.
Foundry services and MUMPS
Conf Call
 
9 2/27
3/1
Foundry services and MUMPS.(cont’d)
CMOS micromachining, actuators, strain gauges, wheatstone bridges
 
hw 3 due
 
10 3/6
3/8
Noise in electrical circuits.
Amplifier noise. Noise in cascaded amplifier stages. Capacitive sensing
hw4
 
 
11 3/13
3/15
Noise equivalent displacement, accelerometers. Parasitic capacitances. Test structures.
Connectivity test structures. Residual stress and strain. Assembly and bonding

hw4 due  
 
12 3/20
3/22
Assembly
Assembly examples and Bonding
 
hw5
 
13 3/27
3/29
WORK ON PROJECT
WORK ON PROJECT

hw5 due
 
14 4/3
4/5
WORK ON PROJECT
WORK ON PROJECT
 
Conf Call
 
15 4/10
4/13
WORK ON PROJECT
Project Reports Due! Must be postmarked by 4/13.
   
16 4/16-
4/20
Final Exam
Must be postmarked by 4/20.