No.
|
Date
|
Lecture
|
Module
|
PDF
(marked)
|
Reading
|
1
|
Jan. 19
|
Admin & Overview, History of IC's
|
|
PDF
|
|
2
|
Jan. 21
|
Materials I
|
|
PDF
|
|
3
|
Jan. 26
|
Materials II
|
|
PDF
|
|
4
|
Jan. 28
|
Process Modules
|
|
PDF
|
Jaegar: Chap. 1
|
5
|
Feb. 2 & Feb. 4
|
Process Integration & Layout
|
|
PDF
|
Jaeger: Chap. 1
|
6
|
Feb. 9
|
Lithography I
|
PDF
|
PDF
|
Jaeger: Chap. 1
|
7
|
Feb. 11
|
Lithography II
|
|
[PDF]
[PDF]
|
Jaegar: Chap. 2
|
8
|
Feb. 16
|
Lithography III
|
|
[PDF]
|
Jaeger: Chap. 2
|
9
|
Feb. 18
|
Oxidation II
|
PDF
|
[PDF]
|
Jaeger: Chap. 3
|
10
|
Feb. 23
|
Film Deposition I & Oxidation
|
PDF
|
[PDF]
[PDF]
|
Jaeger: Chap. 3
|
11
|
Feb. 25
|
Film Deposition II
|
|
[PDF]
[PDF]
|
Jaeger: Chap. 6
|
12
|
Mar. 2
|
Film Deposition III
|
|
[PDF]
[PDF]
|
Jaeger: Chap. 6
|
13
|
Mar. 4
|
Etching I
|
PDF
|
[PDF]
[PDF]
|
Jaeger: Chap. 2
|
14
|
Mar. 9
|
Etching II
|
|
[PDF]
[PDF]
|
Jaeger: Chap. 2
|
15
|
Mar. 11
|
Ion Implantation
|
PDF
|
[PDF]
|
Jaeger: Chap. 5
|
16
|
Mar. 16
|
Diffusion
|
PDF
|
[PDF]
|
Jaeger: Chap. 4
|
|
Mar. 18
|
Midterm Exam
|
|
|
|
|
Mar. 23
|
Spring Break - No Class
|
|
|
|
|
Mar. 25
|
Spring Break - No Class
|
|
|
|
17
|
Mar. 30
|
Diffusion II
|
|
[PDF]
|
Jaeger: Chap. 4
|
18
|
Apr. 1
|
Diffusion III
|
|
[PDF]
[PDF]
|
Jaeger: Chap. 4
|
19
|
Apr. 6
|
Interconnects & Contacts
|
PDF
|
[PDF]
[PDF]
|
Jaeger: Chap. 7
|
20
|
Apr. 8
|
Interconnects & Contacts
|
|
[PDF]
[PDF]
[PDF]
|
Jaeger: Chap. 8
|
21
|
Apr. 13
|
Advanced CMOS II & Punchthrough, Isolation
|
|
[PDF]
[PDF]
[PDF]
|
|
22
|
Apr. 15
|
Advanced Isolation and MOS CV
|
|
[PDF]
[PDF]
|
|
23
|
Apr. 20
|
MOS CV
|
|
[PDF]
|
|
24
|
Apr. 22
|
Vt Implant
|
|
[PDF]
|
|
25
|
Apr. 27
|
Device Characterization
|
|
[PDF]
|
Jaeger: Chap. 11
|
26
|
Apr. 29
|
Yield and Latchup, Course Wrap-Up
|
|
[PDF]
|
Jaeger: Chap. 11
|
|
May. 4
|
Reading/Review/Recitation Week
|
|
|
|
|
May. 6
|
Reading/Review/Recitation Week
|
|
|
|
|
May. 19
|
Final Exam: Monday, May 10, 11:30-2:30 p.m. (Sharp!) (Exam Group 2), 102 Moffitt Hall
|
|
|
|