Course Description
Microfabrication technology has enabeled a paradigm shift in electronics
that will continue to broaden to other applications. This course provides
a broad perspective of microfabrication technologies used in integrated-circuit
processing. The underlying physical mechanisms and their quantitative characterization
through engineering models are emphasized. Unit processes such as lithography,
etching, deposition, metalization, oxidation, diffusion, and ion implant
make up much of the material. Process integration and the trade-offs between
unit processes are also considered. Technology CAD tools such as SIMPL,
SPLAT, SAMPLE, TEMPEST, STORM and SUPREM will be used to illustrate the
current understanding of processing mechanisms and the effect on
device structures and performance. Statistical process control and design
of experiments are also treated. This offering will introduce new material
on lithography modeling and then utilize the new text by Plummer, Deal
and Griffin.
The course will start with an overview of the CMOS process flow (SIMPL).
Weeks 2-5 will be spent on optical imaging, resolution enhancement and
scattering, inspection, resists and next generation lithographies (SPLAT,
SAMPLE, TEMPEST, STORM). Process control and design of experiments will
be introduced as working tools in weeks 6-8. Thermal oxidation, dopant
diffusion and ion implantation will covered in weeks 9-11 (SUPREM IV).
Deposition, etch and metalization will be covered weeks 12-14 (SAMPLE,
SUPREM IV). The process simulators will be utilized for homework and individual
projects.
Required Course Reading:
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[PDG00] "Silicon VLSI Technology Fundamentals, practice and Modeling,"
James D. Plummer, Michael Deal, Peter B. Griffin, Prentice Hall, Upper
Saddle River, NJ, 2000, ISBN 0-13-085037-3. (Ordered by the ASUC Bookstore).
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[ARN L1-L5] Notes on Lthography to be provided by Professor Neureuther.
These notes include basic optical lithography models, image theory,
image enhancement and scattering, resist modeling and non-optical lithography.
-
[DH] "Introduction to Statistical Process Control," by D. Montgomery 2nd
Edition, Chapters 1-4. (on reserve in Eng Library)
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[BHH] "Statistics for Experimenters," by Box, Hunter and Hunter, Chapters
10 and 12. (on reserve in Eng Library)
Reference Books: (on reserve in Eng Library)
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"Microlithography," by Sheats and Smith, Marcel Decker, Inc. New York,
1998. ISBN 0-8247-9953-4
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"Microlithography, Micromachining, and Microfabrication," Volume 1 Micromachining,
edited by P. Rai-Choudhury, SPIE Press, 1997. ISBN 0-8194-2378-5.
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"Silicon Processing for the VLSI Era, Volume 1-Process Technology,"
by Wolf and Tauber, 2nd edition, Lattice Press, 2000, ISBN 0-9616721-6-1
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"VLSI Technology," edited by S.M. Sze, John Wiley.
Homeworks:
Weekly homework will emphasize use of the models in engineering characterization.
Assignments will be posted on the web on Mondays and are due Thursday of
the following week at the start of class. Students will be expected to
contribute their results to the class discussion at that time.
Project:
Students are required to do an individual project related to state-of-the-art
processing technology. The project will describe a process with references,
provide engineering design data and models, add value to the process by
extending the characterization or applying it to a novel situation, and
critique the potential and down side of the process. The use of TCAD tools
or SPC methods are highly encouraged in these investigations. A short (8
min) web based presentation to the class is required near the end of the
semester.
Exam Schedule:
Midterm: Th, October 18, 3:30-5:00 in class,
8th Week (material from weeks 1-7).
Final Exam: W, December 20, 12:30-3:30PM,
(material from weeks 8-15).
Grading Policy:
Homework and Class Participation: 15%
Project: 25%
Midterm: 30%
Short Final Exam: 30%
*** Web Page Revised 9/22/2000 ***