EE243: Advanced IC Processing and Layout

Fall 2000  COURSE INFORMATION

Professor Andy Neureuther  TuTh 3:30-5, 299 Cory

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Course Description

Microfabrication technology has enabeled a paradigm shift in electronics that will continue to broaden to other applications. This course provides a broad perspective of  microfabrication technologies used in integrated-circuit processing. The underlying physical mechanisms and their quantitative characterization through engineering models are emphasized. Unit processes such as lithography, etching, deposition, metalization, oxidation, diffusion, and ion implant make up much of the material. Process integration and the trade-offs between unit processes are also considered. Technology CAD tools such as SIMPL, SPLAT, SAMPLE, TEMPEST, STORM and SUPREM will be used to illustrate the current understanding of  processing mechanisms and the effect on device structures and performance. Statistical process control and design of experiments are also treated. This offering will introduce new material on lithography modeling and then utilize the new text by Plummer, Deal and Griffin.

The course will start with an overview of the CMOS process flow (SIMPL). Weeks 2-5 will be spent on optical imaging, resolution enhancement and scattering, inspection, resists and next generation lithographies (SPLAT, SAMPLE, TEMPEST, STORM). Process control and design of experiments will be introduced as working tools in weeks 6-8. Thermal oxidation, dopant diffusion and ion implantation will covered in weeks 9-11 (SUPREM IV). Deposition, etch and metalization will be covered weeks 12-14 (SAMPLE, SUPREM IV). The process simulators will be utilized for homework and individual projects.

Required Course Reading:

Reference Books: (on reserve in Eng Library)

Homeworks:

Weekly homework will emphasize use of the models in engineering characterization. Assignments will be posted on the web on Mondays and are due Thursday of the following week at the start of class. Students will be expected to contribute their results to the class discussion at that time.

Project:

Students are required to do an individual project related to state-of-the-art processing technology. The project will describe a process with references, provide engineering design data and models, add value to the process by extending the characterization or applying it to a novel situation, and critique the potential and down side of the process. The use of TCAD tools or SPC methods are highly encouraged in these investigations. A short (8 min) web based presentation to the class is required near the end of the semester.

Exam Schedule:

Midterm:  Th, October 18, 3:30-5:00 in class,  8th Week (material from weeks 1-7).
Final Exam:  W, December 20, 12:30-3:30PM, (material from weeks 8-15).

Grading Policy:

Homework and Class Participation: 15%
Project: 25%
Midterm: 30%
Short Final Exam: 30%

*** Web Page Revised 9/22/2000 ***