Week |
Date |
Topic |
Homework |
1 |
9/4
9/6 |
Introduction
Materials used in MEMS |
Conf Call
|
2 |
9/11
9/13 |
Fabrication steps: Deposition, etching and
photolithography. CVD, Oxidation and plasmas
Detailed CVD discussion |
hw1
etchrates
|
3 |
9/18
9/20 |
Different kinds of etching: Plasma etching, wet,
dry etching, HF etching etc.
Etching: liftoff, surface micromachining, Process examples. |
|
4 |
9/25
9/27 |
Start physics of Mems devices. Beam Theory
Beams and electrostatics |
hw2
hw1 due |
5 |
10/2
10/4 |
Flexures / suspensions, electrostatic resonators.
Electrostatic motors. Thermal actuators. |
|
6 |
10/9
10/11 |
Resonance and analysis of resonance in
electrostatic MEMS resonators.
Linear system analysis. Transfer functions, bode plots, Resonator
electrostatics revisited. |
hw3
hw2 due |
7 |
10/16
10/18 |
Analysis of thermal actuation. Electrostatic
springs and Pull in.
Pull in (cont’d), Adhesion. |
|
8 |
10/23
10/25 |
Flow in ducts and its implications for dampening
in electrostatic MEMS resonators.
Foundry services and MUMPS |
Conf Call
hw3 due
|
9 |
10/30
11/1 |
Foundry services and MUMPS.(cont’d)
CMOS micromachining, actuators, strain gauges, wheatstone bridges |
hw4
|
10 |
11/6
11/8 |
Noise in electrical circuits.
Amplifier noise. Noise in cascaded amplifier stages. Capacitive sensing |
|
11 |
11/13
11/15 |
Noise equivalent displacement, accelerometers.
Parasitic capacitances. Test structures.
Connectivity test structures. Residual stress and strain. Assembly and
bonding |
hw4 due
hw5
|
12 |
11/20
11/22 |
Assembly
THANKSGIVING HOLIDAY |
|
13 |
11/27
11/29 |
Assembly examples and Bonding
WORK ON PROJECT |
hw5 due |
14 |
12/4
12/6 |
WORK ON PROJECT
WORK ON PROJECT |
Conf Call
|
15 |
12/11
12/13 |
WORK ON PROJECT
Project Reports Due! Must be postmarked
by 12/14. |
|
16 |
12/17-
12/21 |
Final Exam
Must be postmarked by 12/21. |
|