EE 245 / NEEM 6441: Introduction to MEMS Design

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Week Date Topic Homework
1 9/4
9/6
Introduction
Materials used in MEMS
Conf Call
2 9/11
9/13
Fabrication steps: Deposition, etching and photolithography. CVD, Oxidation and plasmas
Detailed CVD discussion
hw1
etchrates
3 9/18
9/20
Different kinds of etching: Plasma etching, wet, dry etching, HF etching etc.
Etching: liftoff, surface micromachining, Process examples.
 
4 9/25
9/27
Start physics of Mems devices. Beam Theory
Beams and electrostatics
hw2
hw1 due
5 10/2
10/4
Flexures / suspensions, electrostatic resonators.
Electrostatic motors. Thermal actuators.
 
6 10/9
10/11
Resonance and analysis of resonance in electrostatic MEMS resonators.
Linear system analysis. Transfer functions, bode plots, Resonator electrostatics revisited. 
hw3
hw2 due
7 10/16
10/18
Analysis of thermal actuation. Electrostatic springs and Pull in.
Pull in (cont’d), Adhesion.
 
8 10/23
10/25
Flow in ducts and its implications for dampening in electrostatic MEMS resonators.
Foundry services and MUMPS
Conf Call
hw3 due
9 10/30
11/1
Foundry services and MUMPS.(cont’d)
CMOS micromachining, actuators, strain gauges, wheatstone bridges
hw4
 
10 11/6
11/8
Noise in electrical circuits.
Amplifier noise. Noise in cascaded amplifier stages. Capacitive sensing
 
11 11/13
11/15
Noise equivalent displacement, accelerometers. Parasitic capacitances. Test structures.
Connectivity test structures. Residual stress and strain. Assembly and bonding
hw4 due
  hw5
12 11/20
11/22
Assembly
THANKSGIVING HOLIDAY
 
13 11/27
11/29
Assembly examples and Bonding
WORK ON PROJECT

hw5 due
14 12/4
12/6
WORK ON PROJECT
WORK ON PROJECT
 
Conf Call
15 12/11
12/13
WORK ON PROJECT
Project Reports Due! Must be postmarked by 12/14.
 
16 12/17-
12/21
Final Exam
Must be postmarked by 12/21.