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Updated 2/4/08
Schedule
| Week |
Date |
Topic |
Events |
| 1 |
1/22
1/24 |
Introduction
Materials used in MEMS |
Conference call
|
| 2 |
1/29
1/31 |
Fabrication steps: Deposition, etching and photolithography. CVD, Oxidation and plasmas
Detailed CVD discussion |
|
| 3 |
2/5
2/7 |
Different kinds of etching: Plasma etching, wet,
dry etching, HF etching etc.
Etching: liftoff, surface micromachining, Process examples. |
|
| 4 |
2/12
2/14 |
Start physics of MEMS devices. Beam Theory
Beams and electrostatics |
Homework 1 due Thursday |
| 5 |
2/19
2/21 |
Flexures / suspensions, electrostatic resonators.
Electrostatic motors. Thermal actuators. |
|
| 6 |
2/26
2/28 |
Resonance and analysis of resonance in
electrostatic MEMS resonators.
Linear system analysis. Transfer functions, bode plots, Resonator
electrostatics revisited. |
Homework 2 due Thursday |
| 7 |
3/4
3/6 |
Analysis of thermal actuation. Electrostatic springs and pull-in.
Pull-in (cont’d), Adhesion. |
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| 8 |
3/11
3/13 |
Flow in ducts and its implications for damping
in electrostatic MEMS resonators.
Foundry services and MUMPS |
|
| 9 |
3/18
3/20 |
Foundry services and MUMPS (cont’d)
CMOS micromachining, actuators, strain gauges, wheatstone bridges |
Homework 3 due Monday |
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Spring break |
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| 10 |
4/1
4/3 |
Noise in electrical circuits.
Amplifier noise. Noise in cascaded amplifier stages. Capacitive sensing |
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| 11 |
4/8
4/10 |
Noise equivalent displacement, accelerometers.
Parasitic capacitances. Test structures.
Connectivity test structures. Residual stress and strain. Assembly and bonding |
Homework 4 due |
| 12 |
4/15
4/17 |
Assembly
Assembly examples and Bonding |
|
| 13 |
4/22
4/24 |
Work on project |
Homework 5 due |
| 14 |
4/29
5/1 |
Work on project |
|
| 15 |
5/6
5/8 |
Work on project |
|
| 16 |
5/13
5/15 |
Work on project |
Project due (postmarked) 5/16 |
| 17 |
5/20
5/22 |
Final exam |
Exam due (postmarked) 5/22 |
Course Description
The course will begin
with a summary of integrated circuit fabrication technologies leading
into an overview of the technologies available to shape
electromechanical elements on a submillimeter scale. Physics of MEMS
devices will be covered at a level necessary to design and analyze new
devices and systems. Several commercially available MEMS processes will
be discussed in detail, and students will design final projects in
these processes. Topical Areas Include: Basic fabrication techniques:
lithography, thin film deposition, chemical and plasma etching,
anisotropic silicon etching. Device physics: beam theory, electrostatic
actuation, capacitive and piezoresistive sensing, thermal sensors and
actuators. Standard processes: 2 layer polysilicon, CMOS, LIGA,
Electronic interfacing, mechanical and electrical noise, fundamental
limits CAD tools: layout, process simulation, PDE and ODE solvers,
synthesis.
If you have further questions, contact the course consultant.
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